Iimbalasane
Indibano eyodwa, esemgangathweni yekhebula ibonelela ngesisombululo se-hardware esiqhelekileyo esidibanisa amandla kunye nemiqondiso ephantsi kunye nesantya esiphezulu ukwenza lula uyilo lomncedisi.
Isisombululo esiguquguqukayo, esilula ukusisebenzisa sithatha indawo yamacandelo amaninzi kwaye sinciphisa isidingo sokulawula iintambo ezininzi.
Uyilo olubhityileyo kunye nolwakhiwo koomatshini ludibana nee-OCP ezicetyiswa yi-Molex, kwaye i-NearStack PCIe ikhulisa indawo, inciphisa umngcipheko, kwaye ikhawulezisa ixesha lokuthengisa.
Lyle, Illinois-Okthobha 17, 2023-Molex, inkokeli ye-elektroniki yehlabathi kunye nomqalisi woqhagamshelo, uye wandise uluhlu lwayo lweProjekthi ye-Open Computing (OCP)-ecetyiswayo ngezisombululo ngokwaziswa kwe-KickStart Connector System, inkqubo entsha yonke-in-one. eso sisisombululo sokuqala esihambelana ne-OCP. I-KickStart yinkqubo entsha ye-in-one isisombululo sokuqala esihambelana ne-OCP ukudibanisa izibonakaliso eziphantsi kunye nesantya esiphezulu kunye neesekethe zamandla kwindibano enye yekhebula. Le nkqubo epheleleyo iphelisa imfuno yamacandelo amaninzi, ikhulisa indawo, kwaye ikhawulezisa ukuphuculwa ngokubonelela abavelisi be-server kunye nezixhobo zokusebenza ngendlela eguquguqukayo, esemgangathweni, kwaye kulula ukuyisebenzisa yokudibanisa i-peripherals eqhutywa yi-boot.
"I-KickStart Connector System iqinisa injongo yethu yokuphelisa ubunzima kunye nokuqhubela phambili ukunyuka komgangatho kwiziko ledatha yanamhlanje," kusho uBill Wilson, umphathi wophuhliso lwemveliso entsha kwi-Molex Datacom & Specialty Solutions. "Ukufumaneka kwesi sisombululo se-OCP-ethobelayo kunciphisa umngcipheko kubathengi, kunciphisa umthwalo kubo ukuqinisekisa izisombululo ezahlukeneyo, kwaye kubonelela ngokukhawuleza, indlela elula yokuphucula iseva yedatha ebalulekileyo.
Iibhloko zokwakha zeModyuli zamaZiko eeNkcukacha zesiZukulwana esilandelayo
ISiginali eDityanisiweyo kunye neNkqubo yaMandla yifomu encinci yefom factor (SFF) TA-1036 indibano yentambo ehambelanayo ne-OCP's Data Centre Modular Hardware System (DC-MHS). Inkcazo ye-OCP ye-M-PIC yokudibanisa intambo elungiselelwe i-peripheral.
Njengokuphela kwesisombululo soqhagamshelwano se-I / O sangaphakathi esicetyiswa yi-OCP kwizicelo ze-boot drive, i-KickStart yenza ukuba abathengi baphendule ekutshintsheni isantya sesignali yokugcina. Inkqubo ithatha i-PCIe Gen 5 isantya somqondiso kunye namazinga edatha ukuya kwi-32 Gbps NRZ. inkxaso ecwangcisiweyo ye-PCIe Gen 6 iya kuhlangabezana neemfuno ezikhulayo ze-bandwidth.
Ukongeza, i-KickStart ihambelana nefom yefom kunye noomatshini obuqinileyo bokuphumelela ibhaso le-Molex, inkqubo yokudibanisa i-NearStack PCIe ecetyiswayo ye-OCP, enikezela ubuncinci beprofayili yokulinganisa ubude be-11.10mm ukwenzela ukuphuculwa kwendawo, ukulawula ukuhamba komoya, kunye nokunciphisa ukuphazamiseka kwezinye. amacandelo. Inkqubo entsha yokudibanisa iphinde ivumele iipinouts zendibano ye-hybrid elula ukusuka kwi-KickStart connector ukuya kwi-Ssilver 1C ye-Enterprise kunye ne-Data Centre Standard Form Factor (EDSFF) drive mating. Inkxaso yeentambo ezixutyiweyo zenza lula ngakumbi ukudityaniswa kunye neeseva, ukugcinwa, kunye nezinye iiperipherals, ngelixa kusenziwa lula ukuphuculwa kwehardware kunye nezicwangciso zemodyuli.
ImiGangatho eManyeneyo iPhucula uMsebenzi weMveliso kwaye iNciphise imiqobo yokuNikezela ngeNtengo
Ngokufanelekileyo kwiiseva ze-OCP, amaziko edatha, iiseva zebhokisi ezimhlophe, kunye neenkqubo zokugcina, i-KickStart iyanciphisa imfuno yezisombululo ezininzi zokudibanisa ngelixa ukhawuleza ukuphuhliswa kwemveliso. Idizayinelwe ukuxhasa isantya somqondiso wangoku kunye nokutshintsha kunye neemfuno zamandla, iqela ledatha leMolex lophuhliso lwemveliso lisebenza neqela lobunjineli bamandla enkampani ukukhulisa uyilo loqhagamshelwano lwamandla, ukulinganisa ubushushu kunye nokusetyenziswa kwamandla. Njengazo zonke izisombululo zonxibelelwano lwe-Molex, i-KickStart ixhaswa bubunjineli benqanaba lehlabathi, ukuveliswa kwevolumu, kunye nobuchule bokubonelela ngehlabathi jikelele.
Ixesha lokuposa: Oct-30-2023